thermally conductive acrylic interface pad 5590H is a soft acrylic based pad designed to provide a preferential heat transfer path away from heat generating components. Because of its softness, interface pad 5590H can decrease the load to integrated circuit chips during compression, and provides good tack to many surfaces. These properties lead to a high performance non-silicone based thermal pad. interface pad 5590H is a higher thermal conductivity and somewhat firmer acrylic thermal pad, versus interface pad 5589H.
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